TUBESTAR
Batch Type Horizontal Tube Furnace

Semco TUBESTAR is the compact batch-type, single or multi-chambers horizontal furnace offered by ECM Greentech. Key characteristics of this furnace line are: advanced solar cell processing combined with industrial process control, integration modularity, and a user-friendly interface. Each populated chamber can be independently configured and operated in a large range of atmospheric, reduced or low pressure processes. The TUBESTAR furnace can also handle multiple gases and liquid precursors with a temperature range from 200 to 1300°C. Its modular design allows to meet a large range of clean thermal treatment for universities, research laboratories, or small production facilities.
TS156-XT: up to 162mm x 162mm (M0-M4) wafer size
TS166-XT: up to 166mm x 166mm (M4-M6) wafer size

X = chamber/level qty from 1 to 4

Technical Sheet

Substrate dimensions	Up to 200 mm
Substrate material	Si, SiC, GaN, Sapphire, ceramic, quartz, metal
Features	1 to 4 independent process chambers Chamber configurable from M0 to M6 wafer size Configurable for 25/50 or 50/100 wafers per chamber Modular and flexible & tiny footprint Excelent process precision and repeatibility High performance and life-time process technology Low power consumption and low carbon print Over 30 years process expertise 3 or 5 zones resistive heaters up to 1300°C External & internal thermocouple Digital Direct Temperature Control (DDTC) Atmospheric, reduced or low pressure capabilities upon process Gas Cabinet for up to 13 gases Liquid source precursor Cabinet and vaporisation Industrial Process PLC and Windows® based Mycore supervision Compatible with Semiconductor wafer substrate
Options	Process related pump package Laminar Flow class 1 (vertical or horizontal) Furnace roof top with exhaust ducts or water cooled heat exchanger SECS/GEM compliant with SEMI E30, E37 up to customer requirements Dedicated additional process features upon process configuration Manual or automatic boat loading
Integration	Cassette to Cassette Automation with Robitic and Wafer Transfer System

Dry oxydation with O2
Pyrolithic oxidation with H2/O2 torch
Wet Oxide with Pure DI water steamer
Boron or phosphorous dope with liquid, solid or gas source
High temperature diffusion of P or P junction
Low temperature Annealing, Sinter, Alloy

LYDOP phosphorous dope with POCl3 or PH3
LYDOP boron dope with BCl3
LYSINTER forming gas to 100% H2 annealing
LYTOX dry or wet extreme precision oxides

LPCVD Nitride: Stochiometric, Low-Stress, Oxynitride
LPCVD Poly : Flat, Intrinsic or p/n-doped
LPCVD a-Si: Amorphous, Low-Stress
LPCVD SiPOS & MTO
LPCVD 3C-SiC
LPCVD Si on Sapphire
LPCVD TEOS : Undoped, PSG/BPSG, Conformal
LPCVD LTO : Undoped, PSG/BPSG
LPCVD HTO
LPCVD Tungsten

PV 20
Directional solidification furnace G1

PV80
Directional solidification furnace G2

PV600
Directional solidification furnace G6

PV1300
Directional solidification furnace G8

SOLARLAB
Batch type vertical Furnace