VAR SERIES
BATCH TYPE VERTICAL TUBE FURNACE

The VAR Series solution is a flexible & very compact batch-type, single or dual-chambers vertical furnace offered by ECM Greentech. Beside its compact dimensions (tiny footprint & low height), the key characteristics of this equipment are : High precision semiconductor processing combined with industrial process control, integration modularity, and a user-friendly interface. Each populated reactor can be independently configured and operated in a wide range of Sub-atmospheric or Low pressure processes (including CVD & thermal ALD solutions). The VAR Series furnace can also handle multiple gases and liquid precursors with a temperature range from 200 up to 900°C. Its modular design allows to meet a large range of clean thermal treatments for universities, research laboratories, and pilot production facilities.

VAR150-UNO: Single reactor up to 150mm wafer size
VAR150-DUO: Double independent reactors up to 150mm wafer size
VAR200-UNO: Single reactor up to 200mm wafer size
VAR200-DUO: Double independent reactors up to 200mm wafer size

Technical Sheet

Substrate dimensions	Up to 200 mm
Substrate material	Si, SiC, GaN, Sapphire, ceramic, quartz, metal
Features	1 to 2 independent process chambers Chamber configurable for 150mm or 200mm wafer size Configurable for 25/50 wafers per chamber Modular and flexible with tiny footprint Excellent process precision and repeatability High performance and life-time process technology Low power consumption and low carbon footprint Over 30 years process expertise 3 zones resistive heaters up to 900°C Up to 9 thermocouples with Digital Direct Temperature Control (DDTC) Temperature regulation modes Internal, External, Profile, Cascade & Feedforward Sub-Atmospheric or Low Pressure capabilities upon process Gas Cabinet for up to 13 gases Liquid source precursor Cabinet and vaporisation Industrial Process PLC and Windows® based Mycore supervision
Options	Process related pump package SECS/GEM compliant with SEMI E30, E37 Dedicated additional process features upon process requirements Manual or automatic boat loading
Integration	Cassette to Cassette Automation with Robotic and Wafer Transfer System

LYDOP PSG Deposition (POCl3 or PH3 gas source)
LYDOP BSG Deposition (BCl3 gas source)
LYTOX Dry or Wet High Low Temperature Oxides
LYSINTER forming gas Anneal from 0% up to 100% H2
Sub-Atmospheric Anneal for Metals & Bounding
Pyrolytic Anneal

LPCVD Nitride: Stoichiometric, Low-Stress, Oxynitrides
LPCVD Poly : Flat, Low-Stress, Intrinsic or in-situ Doped P/N
LPCVD a-Si: Amorphous Intrinsic or in-situ Doped
LPCVD TEOS : Undoped, PSG/BSG/BPSG, Conformal
LPCVD MTO & SiPOS
LPCVD LTO : Undoped, PSG/BSG/BPSG
LPCVD 3C-SiC
LPCVD Si on Sapphire
LPCVD Tungsten
LPCVD Graphene
LPCVD Multi-processes