The ECM PV LAB Squarer is a diamond based bricking equipment which can handle G2 multi  or mono silicon ingots, in preparation for the wafering process. This  equipment designed for research and development or small production line is very simple to use, cost-effective and compact.

Technical Sheet

Maximal cutting capacity (L * W * H) Ingot 400 mm X 400 mm X 300 mm
Dimensions (L * W * H) 1 500 mm X 1 000 mm X 2 200 mm
Weight 1500 kg
Power supply 400 V
Cutting speed 0 to 10 m/s
Feeding speed 0 to 1 000 mm/mn
Diamond wire saw (closed loop)
4 parallel sawing loops (⌀ 0,6 wire)
2 independent sawing units
Wire breakage detection with motor torque
Saw unit descent actuator (BRUSHLESS-type motor)
Pulley driver (BRUSHLESS-type motor)
90° base-plate rotation
Wire lubrication nozzle with flow rate adjustment
Wire cleaning nozzle with flow rate adjustment
4 safe access doors
Water supply connection 3/8″ G
Wastes evactuation connection 1″ 1/2 G
Cleaning hand shower
Internal lighting
PROFACE HMI with a 6″ monitor
1. Ingot base plate (depending on the type of ingot)
2. Loading cart for ingot handling